Electrode, electronic component and substrate

电极、电子元件和基板

Abstract

The present invention is an electrode 10 so provided as to be soldered to an electronic component 12 and, when the electronic component 12 is mounted on a substrate 13, soldered to the substrate 13. The electrode 10 includes a column-like electrode body 11 soldered to the electronic component 12 and to the substrate 13. The electrode has grooves as an air discharging device discharging the air 15 a in air voids 15 generated within the solder 14 between joint surfaces 11 a, 11 b of the electrode body 11 and the electronic component 12 or the substrate 13 when the electrode body 11 is soldered to the electronic component 12 or the substrate 13.
本发明公开了一种电极(10),所述电极(10)被设置为焊接到电子元件(12),并且当电子元件(12)被安装在基板(13)上时,焊接到基板(13)。电极(10)包括柱状电极体(11),所述柱状电极体(11)被焊接到电子元件(12)并且被焊接到基板(13)。所述电极具有作为排气装置的凹槽,当电极体(11)被焊接到电子元件(12)或基板(13)时,所述排气装置排出在电极体(11)的接合面(11a、11b)与电子元件(12)或基板(13)之间的焊锡(14)内产生的空气空隙(15)中的空气(15a)。

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